Amphenol Aerospace High Density HDB³ and HSB³ Connector Series

Amphenol Aerospace High Density HDB³ and HSB³ Connector Series incorporates a higher density contact pattern and lower mated height than Amphenol's standard low mating force rectangular brush connectors. 

HDB³ connectors utilize the same durable and reliable B³ brush contact in a tighter .070" X .060" staggered grid pattern. The HSB³ Series allows data rates up to 6.250 Gb/s via 100 ohm matched impedance differential pairs.

Features

Polarization: "D" shaped design
HDB³ data rates up to 6.25 Gbps
Keying: Optional keys offer 36 unique keying combinations
Guide Pins: Optional guide pins provide additional alignment
Radial Misalignment: Capable of correcting up to a 020" initial radial misalignment
Angular Misalignment: Capable of mating with up to a 2° initial angular misalignment

Advantages

Higher density contact pattern
Uses less board space
Allows for shorter mated height
Provides the durability and performance of the Brush contact
Low cost

Applications

Transportation
Medical Equipment
Military & Commercial Avionics
C4ISR
UAVs
Naval
High Definition Cameras
Harsh Environments

Performance

Durability: 100,000 mating cycles
Insertion/Extraction Force: 1.5oz typical per contact
Operating Temperature: -65°C to 125°C
Current Rating: 2A Hot swap 1A maximum (load dependent)
Insulation Resistance: 5GΩ minimum
Dielectric Withstanding Voltage: 750V, 60Hz, rms @ Sea Level, 250V, 60Hz, rms @ 70,000Ft elevation
Solderability: MIL-STD-202, Method 208
Salt Fog: 48 Hours IAW MIL-STD-1344, method 1001, test condition B
Humidity: IAW MIL-STD-1344, method 1002, type II
Vibration: 4 hours in each of 3 mutually perpendicular axes IAW MIL STD-1344, method 2005, test condition V, letter H
Shock: 1 shock along each of three mutually perpendicular axes IAW MIL-STD-1344, method 2004,test condition G
Data Rate (HSB3): Capable of up to 6.250 Gbps (consult Amphenol for arrangement)

Materials

Insulator: Liquid crystal polymer, 30% glass filled
Contact
Wire: Beryllium copper per ASTM B197; finish is gold per ASTM B488 over nickel per AMS-QQ-N-290
Holder: Brass similar to UNS C33500; available finishes include gold per MIL-G-45204, tin-lead per MIL-P-81728 or tin per MIL-T-10727 (RoHS Compliant)
Sleeve: Stainless steel per AMS-5514, passivated IAW QQ-P-35 (Daughter Board, I/O and Stacker connector)

Datasheet