KEMET Power Solutions (KPS) MIL Series ceramic stacked capacitors are available in commercial, military and space grades and are well suited for standard and high reliability switch mode power supply (SMPS) and pulse energy applications.
Qualified under performance specification MIL–PRF–49470, our military and space grade products meet or exceed the requirements outlined by DSCC (Defense Supply Center, Columbus) and are available in both B (standard reliability) & T (high reliability) product levels. MIL–PRF–49470 was developed as part of a cooperative effort between the U.S. Military, NASA and SMPS suppliers to produce a robust replacement to cancelled DSCC Drawing 87106.
The KPS MIL Series is constructed using large chip multilayer ceramic capacitors (MLCCs), horizontally stacked and secured to a lead-frame termination system using a high melting point (HMP) solder alloy. The lead frame isolates the MLCCs from the printed circuit board (PCB) while establishing a parallel circuit configuration. Mechanically isolating the capacitors from the PCB improves mechanical and thermal stress performance, while the parallel circuit configuration allows for bulk capacitance in the same or smaller design footprint.
Available in BX, BR, BQ, and X7R dielectrics, these devices are available in encapsulated and unencapsulated styles in both surface mountable and through-hole configurations. Their low Equivalent Series Resistance (ESR) and Equivalent Series Inductance (ESL) make them ideally suited for input and output filtering of power supply as well as snubber applications. The encapsulated styles are primarily used where increased mechanical and environmental
The KPS MIL Series is constructed using large chip multilayer ceramic capacitors (MLCCs), horizontally stacked and secured to a lead-frame termination system using a high melting point (HMP) solder alloy. The lead frame isolates the MLCCs from the printed circuit board (PCB) while establishing a parallel circuit configuration. Mechanically isolating the capacitors from the PCB improves mechanical and thermal stress performance, while the parallel circuit configuration allows for bulk capacitance in the same or smaller design footprint.
Available in BX, BR, BQ, and X7R dielectrics, these devices are available in encapsulated and unencapsulated styles in both surface mountable and through-hole configurations. Their low Equivalent Series Resistance (ESR) and Equivalent Series Inductance (ESL) make them ideally suited for input and output filtering of power supply as well as snubber applications. The encapsulated styles are primarily used where increased mechanical and environmental
- KEMET KPS Series offer up to 10mm of board flex capability
- X7R Automotive AEC-Q200 qualified parts available
- High Temp, High voltage parts available
- Mil-PRF qualified parts available
- A two chip stack offers up to double the capacitance in the same or smaller design footprint when compared to traditional surface mount MLCC devices
- Reduces micro phonic and piezo-electric effects
- Confirms with Standard EIA case codes and footprints
Applications
- DC/DC input & output filters
- Coupling & decoupling
- Point-of-load energy stores
