Arlon’s Next Generation “AD350A” is a woven fiberglass reinforced, ceramic filled, PTFE-based composite material for use as a printed circuit board substrate. It has been redeveloped to provide higher thermal conductivity, lower thermal expansion and better interlaminar and copper bond integrity than the original AD350.
Higher thermal conductivity and low CTE allows it to be used in higher power designs, where temperature extremes are normal and heat rejection is a primary consideration. Lower CTE offers better component attachment reliability as well. AD350A is compatible with the processing used for standard PTFE based printed circuit board substrates. Its low Z-axis thermal expansion improves plated through hole reliability compared to typical PTFE based laminates. Low X-Y expansion improves BGA solder-joint reliability.
AD350A is supplied with 1/2, 1 or 2 ounce electrodeposited copper on both sides. Other copper weights and rolled copper foil are available. AD350A is also available bonded to heavy metal ground planes. Aluminum, brass or copper plate can provide an integral heat sink and mechanical support to the substrate. When ordering AD350A, specify dielectric thickness, cladding, panel size and any other special considerations (AD350A is available in 0.010” increments). Available master sheet sizes include 36" x 48" and 36" x 72".
Features
• Tighter Dielectric Tolerance • Low Z-Axis Thermal Expansion • Ceramic Filled PTFE • High Thermal Conductivity • Large Panel Size Benefits: • Higher Consistency of Performance • Superior PTH Adhesion • Heat Dissipation and Management • Multiple Boards/Panel; Larger Printed Circuit Board formats Typical Applications: • High Power Applications • Low Noise Amplifiers (LNAs) • Low Noise Blocks (LNBs) • Filters and Couplers
Fonte - Arlon, Inc.
20 de marco de 2015
